die bonding process是什么意思 die bonding process怎么读
die bonding process的用法和样例
- In addition to improvements in wire bonder hardware, it is necessary to develop a steady wire bonding process which satisfies the requirements for ultra-fine-pitch wire bonding.
目前除了需要不断提高键合机硬件性能外，开发满足超细间距引线键合要求且性能稳定的键合工艺十分必要。
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